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                  UL /IEC/ EN 60950 Test Probe Kits BND-TPK01

                  Product Description:UL /IEC/ EN 60950 IEC61032 Test Probe KitsModel:BND-TPK01Product Details:The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:· IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)· 50mm Impact Test Ball (BND-G500R)
                  Description

                  Product Description:

                  UL /IEC/ EN 60950 IEC61032 Test Probe Kits

                  Model:BND-TPK01


                  Product Details:

                  The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:

                  · IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)

                  · 50mm Impact Test Ball (BND-G500R)

                  · Test Pin Probe: short (BND-13)

                  · Rigid Finger Probe (BND-11)

                  · Ball Pressure Tester (BND-QY102)

                  · Telecom Test Probe (BND-TB12)

                  Meets Requirements for Testing Standard(s) including but not limited to:IEC 60950EN 60950UL 60950CSA 950


                  Datasheets of BND-TPK01 test probe kit:


                  test probe B 1.jpgIEC61032  IEC60950  IEC60335
                  IEC60529  IEC60045  IEC60884
                  IEC60745
                  Knurled Finger Diameter:12mm
                  Knurled Finger Length:80mm
                  Baffle Plate Diameter:50mm
                  Baffle Plate Length:100mm
                  Baffle Thickness:20mm
                  BND-G500R
                  Test Sphere 500G with ring
                   2.jpgIEC61032  IEC60529Diameter:50mm
                  Weight:227g
                  BND-13
                  Short Test Pin
                   3.jpgIEC60065
                  IEC60335
                  IEC61032
                  The probe Diameter:Head 3mm Tail 4mm
                  The probe Length:15mm
                  Dam-board Diameter:25mm
                  Dam-board Thickness:4mm
                  BND-11
                  Rigid Test Probe 11
                   4.jpgIEC61032
                  IEC60065
                  IEC60335
                  IEC60884
                  Nodular Finger Length:80mm
                  Nodular Finger Diameter:12mm
                  Dam-board Diameter:50mm
                  Dan-board Thickness:5mm
                  BND-TB12
                  12mm Telecom Test Probe
                   5.jpgIEC60065 IEC60695 IEC60950Probe Diameter:12mm
                  Probe Length:80mm
                  Baffle Plate Diameter:50mm
                  BND-QY102
                  Ball Pressure Apparatus
                   6.jpgIEC60695-10-2 IEC60884
                  IEC60320 IEC60335
                  IEC60598
                  IEC60950
                  Ball diameter:5MM
                  Total test pressure:20N±0.2N
                  Samples bearing Diameter:50mm,Length:100mm Solid stainless steel cylinder



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